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　　Core Parameters and Features

　　Power and Frequency: 1250W, 13.56MHz (RF output), supports three-phase 208-220V AC input (50/60Hz, 10A)

　　Cooling Method: Water cooling

　　Interfaces and Control: Equipped with Control and CEX In/Out communication interfaces, supports closed-loop control

　　Physical Dimensions: 134×216×381mm, packaged in a cardboard box or plastic explosion-proof box

　　Core Function: Plasma generation and control

　　RF Energy Core Source: As a high-power generator (typical output 1250W) in the 13.56MHz industrial standard RF band, it drives the plasma system by converting DC power to high-frequency AC power. Its working principle encompasses oscillator generating high-frequency signals → power amplifier amplification → filter suppressing harmonics → impedance matching network achieving maximum power transmission, ultimately exciting plasma for use in semiconductor, industrial coating, and other applications.

　　Plasma Density and Energy Control: By precisely adjusting the power (adjustable 1250W), frequency, and pulse mode (e.g., multi-level pulse modulation), the plasma density, energy distribution, and ion bombardment intensity are controlled, directly affecting etching rate, uniformity, and precision. For example, in high aspect ratio etching of 3D NAND, multi-level pulse technology can optimize process margins and ensure structural integrity.

　　Dynamic Control Characteristics: Supports multi-level pulse modulation, arc management, and fast dynamic response (<200ms power adjustment), adapting to dynamic changes in plasma impedance (e.g., gas type/pressure fluctuations) to ensure process stability.

　　Key Process Applications:

　　Semiconductor Manufacturing:

　　Plasma Etching: Used for nanoscale etching of materials such as silicon and silicon oxide (e.g., capacitively coupled plasma (CCP), inductively coupled plasma (ICP), supporting the high precision requirements of advanced processes (e.g., FinFET, 3D NAND).

　　Thin Film Deposition: Achieves uniform deposition of insulating and conductive layers (e.g., transparent conductive layers) through CVD/PVD processes, improving chip performance.

　　Photovoltaic and Display Panels: Used in thin-film deposition (e.g., anti-reflective coatings) and surface treatment to improve photoelectric conversion efficiency and display quality.

　　Industrial Coating: Used for glass/metal surface hardening, anti-corrosion coatings, and decorative coatings (e.g., anti-fingerprint, wear-resistant coatings) to enhance material durability and functionality.

　　Key Process Support:

　　Etching and Deposition: Utilizing ionized process gases (e.g., CF₄, Ar) to form highly active plasma, enabling precise etching (e.g., silicon, metal layers) and thin-film deposition (CVD/PVD) on wafer surfaces, directly affecting film thickness, density, stress, and etching directionality/selectivity.

　　Cavity Cleaning and Photoresist Removal: Utilizing the chemical activity of plasma to remove chamber residues or photoresist, improving equipment utilization and process yield.

　　Accuracy and Reliability: Frequency accuracy ≤ ±0.005%, power stability ≤ ±0.1%, with real-time adjustment via impedance matching (e.g., L-type network dynamic compensation reactance) to ensure precise plasma energy control, reduce reflected power loss (up to 40% or more), and prevent equipment hardware damage.

　　Technical Parameters and Process Advantages

　　Frequency and Power Flexibility: Supports a standard frequency of 13.56MHz and an adjustable range (e.g., 100kHz-150MHz), with precisely adjustable power output (600W-1250W) to adapt to different process requirements.

　　Pulse Modulation Technology: Multi-stage pulse (MLP) synchronously controls ion energy and chemical reaction time, reducing by-product deposition and improving etching selectivity.

　　Impedance Matching and Protection: Built-in reflected power monitoring and automatic tuning functions ensure load impedance matching (50Ω) to prevent power amplifier damage; a water-cooling system maintains the temperature of critical components, ensuring stable operation over long periods.

　　Compatibility and Integration: Supports industrial protocols such as EtherCAT, Ethernet, and RS-232; rack-mountable (134×216×381mm); compatible with automated control systems, enabling remote monitoring and operation.

　　Industrial Protocol Compatibility: Supports protocols such as EtherCAT, Ethernet, RS-232, and DeviceNet; seamlessly integrates with PLC and MES systems, enabling real-time monitoring and automated scheduling of production data (e.g., full lifecycle management of electroplating production line fixtures).

　　Upgrade and Maintenance: Upgrades to Paramount 1250 via the "RFG/RFDS 1250 to Paramount 1250" solution, resetting equipment lifespan and improving reliability (e.g., SEMI F47 voltage fluctuation protection); provides a 6-month warranty and rapid response repair service (repair rate over 90%).

　　Environmental Adaptability: IP67 protection rating, wide temperature range support (-20℃~85℃), suitable for harsh industrial environments such as electroplating and stamping, ensuring 100,000 hours of trouble-free operation.

　　Cross-Industry Application Expansion

　　Industrial Coating: In glass/metal surface hardening, anti-reflective coatings, and decorative coatings, plasma-enhanced deposition processes improve coating uniformity and adhesion, extending product lifespan.

　　Photovoltaic and Display Panels: Used for thin-film deposition (e.g., transparent conductive layer ITO) and surface treatment (e.g., anti-reflective coatings), optimizing photoelectric conversion efficiency and display performance.

　　Medical and Scientific Research: Supports RF induction heating and power modules for medical devices, meeting the high reliability requirements of sterile environments.

　　Equipment Stability and Support System

　　Redundant Design and Safety Certification: Dual power module design ensures process continuity; compliant with CE, UL, and other safety standards, guaranteeing equipment safety and reliability.

　　Global Service Network: Advanced Energy provides technical documentation, driver software, and global after-sales service; authorized repair shops (e.g., Shenzhen Yongjiachuang Industrial Automation) provide rapid response services, supporting repairs of power modules, RF output units, and cooling systems, including a 6-month warranty.

　　Process Optimization Support: Through precise parameter adjustment (such as frequency, power, and pulse mode) and real-time monitoring, process repeatability and yield are ensured, meeting the high-precision requirements of semiconductors, photovoltaics, and display panels.

　　Other Product Series

　　Core Parameters: The RFDS 1250 model uses the 13.56MHz industrial standard RF band, with an output power of 1250W. A water-cooling system ensures stable operation under long-term high loads. Input power is three-phase 208-220V, 10A, 50/60Hz, with a total power consumption of approximately 2.0kW.

　　Interfaces and Compatibility: Supports industrial protocols such as EtherCAT, Ethernet, RS-232, and DeviceNet. Rack-mountable (dimensions 134×216×381mm), weighing approximately 15-30kg. Compatible with RFG 1250, RFG 2000-2V, and other devices, supporting advanced functions such as multi-level pulse modulation and arc management.

　　Upgrade Options: The Paramount 1250 model offers faster dynamic response (<2ms rise/fall time), a wider power range (5W-1250W), and higher power accuracy (±2% or 1.5W), and supports SEMI F47 voltage fluctuation protection.

　　Application Areas

　　Semiconductors and Photovoltaics: Primarily used for RF power supply in semiconductor production lines, photovoltaic equipment, and LED panel manufacturing, such as in plasma etching and thin film deposition processes.

　　Industrial Equipment: Power modules for CNC systems, servo drives, industrial displays, etc., commonly found in industrial automation maintenance scenarios.

　　Medical and Scientific Research: Some cases show its potential use in medical equipment (such as high-frequency electrosurgical units) or scientific instruments (such as high-voltage power supplies for electrostatic oil mist purifiers).

　　Economic and Efficiency Value

　　Cost Optimization: Achieves total cost savings by reducing manual intervention (e.g., automatic process parameter setting), lowering product defect rates (up to 30%), and improving production efficiency (e.g., reducing assembly error rates by 90%).

　　Data-Driven Decision Making: Built-in data logs and a virtual front interface support health monitoring and process trend analysis, facilitating factory digital transformation.

　　Summary: As a precision RF power supply solution, the Advanced Energy RFDS Generator provides core process support in semiconductor manufacturing, industrial coating, photovoltaic/display, and other fields through high-frequency energy conversion and precise control. Simultaneously, through system integration and maintenance optimization, it improves production efficiency and equipment reliability, making it a key infrastructure for smart manufacturing in the Industry 4.0 era.

　　All products on this website are special products, and market prices are constantly fluctuating.

　　Please refer to customer service for a quote, as the price is not accurate for new products.

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